PROBE CARD

摘要

Accuracies in planarity and parallelism of a substrate having a wiring pattern are improved, irrespective of whether the substrate is deformed or not. The probe card is provided with a plurality of probes composed of a conductive material for inputting or outputting electrical signals by being brought into contact with a semiconductor wafer; a probe head for storing and holding the probes; the substrate having the wiring pattern corresponding to a circuit structure for generating the signal for inspection; a reinforcing member for reinforcing the substrate by being mounted on the substrate; an interposer stacked on the substrate for relaying the wiring of the substrate; a space transformer, which is stacked between the interposer and the probe head, converts the interval of the wiring relayed by the interposer and is exposed from the surface on the side facing the probe head; and a plurality of first post members, which are embedded by penetrating the substrate from the surface portion of the substrate whereupon the interposer is stacked, and have a height more than the thickness of the substrate.