| 摘要 |
An object of the present invention is to improve the compatibility of the resin composition comprising the PAI resin and the PAS resin so as to provide a resin composition which is excellent in flowability when molten, strength, tenacity and heat resistance. <??>A resin composition comprising: (1) 5 to 60 parts by weight of aromatic polyamide imide resin (A) having a weight average molecular weight (Mw) of 1,000 to 100 , 000 and having an amino group in an amount of 0.00002 to 0.002 mol/g in a molecule, (2) 95 to 40 parts by weight of polyarylene sulfide resin (B), and (3) 0.01 to 10 parts by weight of episulfide compound (C) based on 100 parts by weight of the total of (A) and (B). |
