Mold for semiconductor package and molding method,申请号KR20010017447-传众专利搜索

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发明名称	Mold for semiconductor package and molding method
摘要
申请公布号	KR100729025(B1)	申请公布日期	2007.06.14
申请号	KR20010017447	申请日期	2001.04.02
申请人		发明人
分类号	H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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