| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device for improved optical characteristics and electrical characteristics by applying Ag plating to the reflecting region of a conductive part, and by applying Au plating to the terminal region of the conductive part. <P>SOLUTION: A semiconductor light emitting device 10 comprises a pair of conductive parts 15 and 16, a semiconductor light emitting element 12 jointed to an element mounting part 15a at the tip of one conductive part, and a transparent resin 14 that covers a part of the conductive parts and the semiconductor light emitting element. At least surfaces of the conductive parts comprise metal layers. Terminals 15b and 16b drawn out of the conductive parts comprise Au layers formed on surfaces of the metal layers. At least the end that faces the element mounting part of the Au layer is covered with the transparent resin. The element mounting part of the conductive parts and its peripheral region comprise the Ag layer separated from the Au layer on the surface. <P>COPYRIGHT: (C)2007,JPO&INPIT |
