| 摘要 |
PROBLEM TO BE SOLVED: To provide a high rigidity wafer holder in which positional accuracy and soaking properties can be enhanced by enhancing heat insulation effect and a chip can be heated or cooled quickly while reducing the manufacturing cost, and to provide a wafer prober mounting it. SOLUTION: The wafer holder comprising a mounting stand having a surface for mounting a wafer, and a member for holding the mounting stand satisfies following relations K1>K2 and Y1<Y2, wherein K1 and Y1 are the thermal conductivity and the Young's modulus of the mounting stand, and K2 and Y2 are the thermal conductivity and the Young's modulus of the holding member. Furthermore, a supporting member is provided below the holding member and the thermal conductivity K3 of the holding member preferably satisfies following relation K2>K3. COPYRIGHT: (C)2007,JPO&INPIT |
