| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain an underfill composition having a lower modulus of elasticity than that of a conventional underfill material and to provide a semiconductor apparatus having a high connection reliability using the same. <P>SOLUTION: The underfill composition 16 comprises at least one kind of a compound A selected from a butadiene compound and a urethane compound, at least one kind of a compound B composed of a compound containing two or more epoxy groups in the molecule, a curing agent and an inorganic filler. The semiconductor apparatus is manufactured by filling the underfill composition between a VCSEL 15 and a printed wiring board 11. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
