| 摘要 |
PROBLEM TO BE SOLVED: To secure high dimension accuracy and productivity of a tall probe pin. SOLUTION: A groove 20 is formed on the side face of the probe pin 10, and the tip part side having a contact part 21 is bent from the groove 20 part. The tip of the probe pin 10 is formed in a sharpened shape and used as the contact part 21. The rear end side from the groove 20 of the probe pin 10 is bonded to a connection terminal 11a of a contactor 11, and the tip part side of the probe pin 10 is bent to the lower side having a wafer W from the groove 20 part. The contact part 21 of the probe pin 10 is brought into contact with the wafer W, and electric characteristics of the wafer W are inspected. COPYRIGHT: (C)2007,JPO&INPIT
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