| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for sticking a protective substrate suitably by removing bubbles from the stage of resin coating process. SOLUTION: The method for processing the other side of a substrate (10) having one side provided with a plurality of structures (36) comprises a first step for coating one side of the substrate (10) with adhesive (400), a second step for applying a negative pressure and a positive pressure sequentially to the adhesive, a third step for arranging a protective substrate (420) on the adhesive, a fourth step for processing the other side of the substrate, and a fifth step for stripping the protective substrate (420) from the substrate. COPYRIGHT: (C)2007,JPO&INPIT
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