| 摘要 |
PROBLEM TO BE SOLVED: To mount a semiconductor element without destroying by reducing warp of the semiconductor element, and reducing damage on the upper portion of the semiconductor element when it is picked up. SOLUTION: The semiconductor element pickup jig comprises a recess 12 in the lower end face of a jig body 11, a sidewall portion 13 forming the recess 12, an inclining portion 15 on the lower end face 14 of the sidewall portion 13, and a flat portion 16 at a position of predetermined height from the lower end face 14 on the upper end side of a set of opposing inclining portions 15. At least a set of suction holes 17 are provided at the relative position of the flat portion 16, and the suction holes 17 are formed to penetrate the jig body 11 from the upper end side thereof to the flat portion 16 on the lower end side and to communicate with a suction device. Furthermore, a flat elastic body 18 is provided at a part other than the suction holes 17 arranged on the surface of the flat portion 16. Since the suction holes 17 are provided at positions for sucking the end portion of a semiconductor chip 40, warp is reduced and generation of voids is prevented, and damage on the upper surface of the semiconductor chip 40 is reduced by the elastic body 18. COPYRIGHT: (C)2007,JPO&INPIT |
