发明名称 |
METHOD AND SYSTEM FOR WAFER TEMPERATURE CONTROL |
摘要 |
Systems and methods for controlling the temperature of a wafer are disclosed. These systems and methods may employ a back side wafer pressure control system (BSWPC) that includes subsystems and a controller operable in tandem to control the temperature of wafers in one or more process chambers. The subsystems may include mechanical components for controlling a flow of gas to the backside of a wafer while the controller may be utilized to control these mechanical components in order to control wafer temperature in a process chamber. Furthermore, embodiments of these systems and methods may also use a chiller in combination with the controller to provide both coarse and fine temperature control.
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申请公布号 |
KR20070061871(A) |
申请公布日期 |
2007.06.14 |
申请号 |
KR20077008380 |
申请日期 |
2007.04.13 |
申请人 |
CELERITY, INC. |
发明人 |
TINSLEY KENNETH E.;TISON STUART A. |
分类号 |
H01L21/66;C23C16/00;F24F7/00;H01L21/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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