| 摘要 |
A retention module with EMI suppression includes a retention frame 11 disposed on a PCB 2, metallic elastomers 12, a backboard 13 disposed on a bottom of the PCB and grounding elements 14 disposed between the PCB and the backboard. The retention frame is formed with a receiving space 111 for receiving an electronic element, such as a CPU, and connects to the backboard via two fasteners 15. The metallic elastomers have elastic parts 126 and first contacting parts 127. The grounding element has a second contacting part 142 and grounding parts 143. The first and second contacting parts contact conductors 21 formed on the PCB. EMI in the electronic element is guided to a host housing via the metallic elastomer and the grounding element. A heat sink 5 may be received in the retention frame. |
