WAFER MANUFATURING METHOD AND WAFER MANUFATURING APPARATUS

摘要

A semiconductor manufacturing method and a semiconductor manufacturing apparatus are provided to load compactly semiconductor substrates into a boat and to improve productivity by using an improved arrangement of support rods. A holder ring(12) is used for supporting a lower edge portion of a semiconductor substrate. A plurality of support rods(16) are protruded from a boat frame(22) in order to support holder rings. The plurality of support rods are properly arranged with each other, so that an end effector(18) is capable of performing substrate loading/unloading processes without the impact between the support rod and the end effector itself.