Multilayer printed circuit board

摘要

The invention provides a multilayered printed circuit board comprising a substrate and, as serially built up thereon, a conductor circuit (105) and an interlaminar resin insulating layer (102) in an alternate fashion and in repetition, and a solder resist layer (114) formed further thereon as an outermost layer, with a connection of said conductor circuits through said interlaminar resin insulating layer being performed by a via-hole, wherein via-holes in different level layers among said via-holes are formed so as to form the stack-via structure (1071-1073), and among said interlaminar resin insulating layers (102), a coefficient of linear expansion of the interlaminar resin insulating layer in the outermost layer is smaller than the coefficients of linear expansion of the interlaminar resin insulating layers in other layers or equal to the coefficients of linear expansion of the interlaminar resin insulating layers in other layers.