| 摘要 |
A semiconductor device is provided to miniaturize a semiconductor sensor chip without changing a size of the semiconductor sensor chip and to mount stably the semiconductor sensor chip on a PCB. A semiconductor sensor having a diaphragm for detecting a change of pressure on the basis of displacement thereof is fixed on an upper surface of a rectangular substrate(3). A hollow space for surrounding a semiconductor sensor chip(5) is formed between the substrate and a cover member. The substrate is sealed with a molding resin so that a plurality of chip connection leads and a plurality of packaging leads are partially exposed to the outside. The chip connection leads are electrically connected to the semiconductor sensor chip and are arranged in a line along one side of the semiconductor sensor chip. The packaging leads are disposed opposite to the chip connection leads by the semiconductor sensor chip. |
