| 发明名称 |
INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING. |
| 摘要 |
<p>A semiconductor structure (5), fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate (10) is formed from a conductive layer (30).</p> |
| 申请公布号 |
MX2007003615(A) |
申请公布日期 |
2007.06.13 |
| 申请号 |
MX20070003615 |
申请日期 |
2005.09.21 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
SIMON DODD;S. JONATHAN WANG;DENNIS W. TOM;FRANK R. BRYANT;TERRY E. MCMAHON;RICHARD TODD MILLER;GREGORY T. HINDMAN |
| 分类号 |
H01L23/31 |
主分类号 |
H01L23/31 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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