发明名称 |
Method for producing electrical connections between circuit boards |
摘要 |
<p>The method involves soldering electrical contact units (14) with a printed circuit board (12). The contact units are provided with a soldering lug that is inserted into soldering holes in a printed circuit board (10). The contact units are set in a soldering paste that is applied on the circuit board (10). The contact units are soldered with the circuit board (10) according to a reflow-process. A process of fitting the circuit board (10) with the contact units and of soldering the contact units with the circuit board (10) is directly integrated into a surface-mount device-line. An independent claim is also included for an arrangement of two electrically connected printed circuit boards arranged to each other in an angle.</p> |
申请公布号 |
EP1796217(A1) |
申请公布日期 |
2007.06.13 |
申请号 |
EP20050026847 |
申请日期 |
2005.12.08 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
SCHMITZ, KLAUS-DIETER |
分类号 |
H01R12/52;H01R12/58;H01R12/72;H01R12/73;H01R43/20;H05K3/34;H05K3/36 |
主分类号 |
H01R12/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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