发明名称 Method for producing electrical connections between circuit boards
摘要 <p>The method involves soldering electrical contact units (14) with a printed circuit board (12). The contact units are provided with a soldering lug that is inserted into soldering holes in a printed circuit board (10). The contact units are set in a soldering paste that is applied on the circuit board (10). The contact units are soldered with the circuit board (10) according to a reflow-process. A process of fitting the circuit board (10) with the contact units and of soldering the contact units with the circuit board (10) is directly integrated into a surface-mount device-line. An independent claim is also included for an arrangement of two electrically connected printed circuit boards arranged to each other in an angle.</p>
申请公布号 EP1796217(A1) 申请公布日期 2007.06.13
申请号 EP20050026847 申请日期 2005.12.08
申请人 DELPHI TECHNOLOGIES, INC. 发明人 SCHMITZ, KLAUS-DIETER
分类号 H01R12/52;H01R12/58;H01R12/72;H01R12/73;H01R43/20;H05K3/34;H05K3/36 主分类号 H01R12/52
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