发明名称 |
Method of making an electronic device cooling system |
摘要 |
<p>A method is provided. The method includes forming a conductive layer on an inner surface of a substrate (12) and providing a sacrificial layer (36) over the conductive layer. The method includes forming a plurality of channels in the sacrificial layer (36) and plating the sacrificial layer to substantially fill the plurality of channels with a plating material comprising conducting material. The method also includes etching the sacrificial layer (36) to form a conducting structure having fins where conducting material remains separated by microchannels where the sacrificial layer (36) is etched.</p> |
申请公布号 |
EP1796138(A2) |
申请公布日期 |
2007.06.13 |
申请号 |
EP20060125828 |
申请日期 |
2006.12.11 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
DUROCHER, KEVIN MATTHEW;GOODWIN, STACEY JOY;BALCH, ERNEST WAYNE;KAPUSTA, CHRISTOPHER JAMES |
分类号 |
H01L21/00;F28D1/03;H05K7/20 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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