SUBSTRATE PROCESSING METHOD FOR INCREASED SUBSTRATE THROUGHPUT

摘要

A substrate processing method is provided to restrain the deformation of a substrate by heating uniformly the substrate and to improve the production of substrate by heating quickly the substrate. A substrate is loaded into a process chamber under a loading/unloading pressure condition(S10). The pressure of the process chamber is changed into a base pressure(S14). The pressure of the process chamber is changed into a heating pressure and the substrate is transferred from a loading/unloading position to a substrate processing position. The substrate is heated up to a process temperature(S20). The pressure of the process chamber is changed into a substrate processing pressure(S22). A substrate processing process is performed on the substrate(S24).