| 摘要 |
A semiconductor substrate transfer robot is provided to prevent the damage of a semiconductor substrate by using one or more detecting sensors. A semiconductor substrate transfer robot includes a body(105), an arm, a blade and one or more detecting sensors. The arm(110) is connected to the body. The blade(115) is connected to the arm. The blade is used for mounting a semiconductor substrate. The detecting sensors(130) are installed on the blade. The detecting sensors are capable of detecting the motion of the substrate. The detecting sensor is used for detecting the motion of the substrate by using light. The semiconductor substrate transfer robot further includes a connection part capable of connecting the arm with the blade.
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