Thermal conductive substrate and electronic assembly
摘要
<p>An electronics assembly (10) is provided including a circuit board substrate (20) having a top surface and a bottom surface and a plurality of thermal conductive vias (26) extending from the top surface to the bottom surface. At least one electronics package (12) is mounted to the top surface of the substrate (20). A heat sink device (30) is in thermal communication with the bottom surface of the substrate (20). Thermal conductive vias (26) are in thermal communication to pass thermal energy from the at least one electronics package (12) to the heat sink (30). At least some of the thermal conductive vias (26) are formed extending from the top surface to the bottom surface of the substrate (20) at an angle (¸).</p>
申请公布号
EP1796444(A2)
申请公布日期
2007.06.13
申请号
EP20060077045
申请日期
2006.11.17
申请人
DELPHI TECHNOLOGIES, INC.
发明人
FAIRCHILD, M. RAY;DJORDJEVIC, ALEKSANDRA;RUIZ, JAVIER