发明名称
摘要 PROBLEM TO BE SOLVED: To radiate heat of the part of a power system circuit, which is heated, at a low cost, regarding an electronic circuit device comprising a small-power system circuit and the power system circuit. SOLUTION: An electronic circuit device 100 comprises the small-power system circuit 124 which, formed on a ceramic board 150, comprises a small- power type 151, and the power system circuit 121 and 122 which are, comprising mainly a large-power type part 170, respectively, formed on a bus bar unit 160 in which a conductor 163 is provided to a support body 161 comprising an insulating material. The small-power system circuit is provided at the bottom surface 112 of a box-like metal case 110. The bus bar unit comprising the power system circuit is provided away from the small-power system circuit. The small- power system circuit is electrically connected to the power system circuit. A part 171 such as a power semiconductor which is heated among the large-power type parts is fixed to the metal case through adhesives 180 and 190 of insulating characteristics and high heat transfer characteristics.
申请公布号 JP3928694(B2) 申请公布日期 2007.06.13
申请号 JP20010046411 申请日期 2001.02.22
申请人 发明人
分类号 F21V23/02;H05K7/20;F21V29/00;F21W101/10 主分类号 F21V23/02
代理机构 代理人
主权项
地址