ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATING METHOD

摘要

An electroless plating apparatus and an electroless plating method which can perform electroless plating on a wiring part on a substrate with a plating solution using a reducing agent having low reduction power without deteriorating quality of the substrate such as a semiconductor device and the like are provided. The electroless plating apparatus comprises: a press pin(64) which supports a wafer(W), and has conductivity; a metal member(64b) which is installed at the press pin such that the metal member comes in contact with a plating solution, and which dissolves into the plating solution and generates electrons when the metal member comes in contact with the plating solution; and an electron supply passage which supplies the electrons generated when the metal member is dissolved into the plating solution to a wiring part on the wafer through the press pin.