发明名称 Multilayered chip capacitor and printed circuit board having embedded multilayered chip capacitor
摘要 A multilayered chip capacitor (MLCC) includes internal electrodes and external electrodes formed to be perpendicular to the internal electrodes, whereby parasitic capacitance is reduced, resulting in no parallel resonance frequency effects. In addition, the MLCC has a capacitor structure, which provides a first surface and a second surface formed in a stacking direction of the dielectric layers in the capacitor body as a top surface and a bottom surface. Hence, in the thin capacitors having the same size, the number of internal electrode layers is increased, thereby reducing the equivalent series resistant (ESR) and equivalent series inductance (ESL). Further, the printed circuit board (PCB) having an embedded MLCC is easily manufactured.
申请公布号 US7230815(B2) 申请公布日期 2007.06.12
申请号 US20050288802 申请日期 2005.11.29
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD 发明人 YOON HEE SOO;SHIM CHANG HOON;CHOI DON CHEOL;LEE DONG HWAN
分类号 H01G4/005;H01G4/06 主分类号 H01G4/005
代理机构 代理人
主权项
地址