Method for matching two measurement methods for measuring structure widths on a substrate

摘要

The invention relates to a method for matching a first measurement method for measuring structure widths of trapezoidally tapering structures on a substrate wafer to a second measurement method for measuring the structure widths. This is performed in order to obtain measured values for the structure width which are comparable with one another. The second measurement method is suitable for measuring a second structure width at an unknown second height above the surface of the substrate, and the first measurement method is suitable for measuring a first structure width at a first height, the first height being settable.