| 发明名称 |
Capacitor placement for integrated circuit packages |
| 摘要 |
A side-mounted capacitor for a semiconductor die package is described. In one embodiment, a substrate has a die side to which an IC (integrated circuit) may be attached, and an edge adjacent the die side. A bypass capacitor is attached to the package substrate edge. |
| 申请公布号 |
US7230317(B2) |
申请公布日期 |
2007.06.12 |
| 申请号 |
US20040937080 |
申请日期 |
2004.09.08 |
| 申请人 |
INTEL CORPORATION |
发明人 |
PEARSON TOM E.;DISHONGH TERRY J.;AMIR DAVID;SEARLS DAMION |
| 分类号 |
H01L29/00;H01L23/02;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L29/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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