发明名称 Phase change memory device and method of manufacture thereof
摘要 A method of manufacturing a memory device is provided. The method includes forming an electrode over a substrate. The method also includes forming an opening in the electrode to provide a tapered electrode contact surface proximate the opening. The method further includes forming a phase change feature over the electrode and on the tapered electrode contact surface.
申请公布号 US7229883(B2) 申请公布日期 2007.06.12
申请号 US20050064132 申请日期 2005.02.23
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 WANG CHAO-HSIUNG;LAI LI-SHYUE;TANG DENNY;LIN WEN-CHIN
分类号 H01L21/336 主分类号 H01L21/336
代理机构 代理人
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