发明名称 Solid-state image pickup device and fabrication method thereof
摘要 A solid-state image pickup device includes: a plurality of light receiving portions arranged in a matrix, and a vertical transfer register which is four-phase driven by first, second, third and fourth transfer electrodes of a three-layer structure. The vertical transfer register is provided for each of columns of the light receiving portions. The first and third transfer electrodes of the first layer are alternately arranged in a charge transfer direction, and the adjacent two of the first and third transfer electrodes extend in parallel to each other between the light receiving portions. With this solid-state image pickup device, the accumulated charge capacity of each transfer region composed of the adjacent transfer electrodes for two-phases is equalized and the area of the light receiving portion is increased irrespective of variations in processed dimension between the transfer electrodes.
申请公布号 US7230288(B2) 申请公布日期 2007.06.12
申请号 US20060500212 申请日期 2006.08.07
申请人 SONY CORPORATION 发明人 YAMANE JUNJI;HIKICHI KUNIHIKO
分类号 H01L27/148;H01L29/74;H01L29/768;H01L29/80;H01L31/0288;H04N5/335;H04N5/341;H04N5/369;H04N5/3722;H04N5/3728 主分类号 H01L27/148
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