| 摘要 |
A semiconductor device is provided to easily determine the position of a ceiling plate of a cover member with respect to a substrate by hanging a pair of sidewall parts to the lateral surface of the substrate. A hollow cavity part is formed in the surface of a substrate(3). A semiconductor chip is mounted on the cavity part of the substrate. A cover member includes a ceiling plate of an almost plate type and at least a pair of sidewall parts. The cavity part is covered with the ceiling plate confronting the substrate. The pair of sidewall parts is hung to the lateral surface of the substrate, protruding from the circumference of the ceiling plate toward the substrate. An opening can be formed in the ceiling plate, penetrating the substrate in a thickness direction and connecting the hollow cavity part to the outside. |
