| 摘要 |
A substrate processing apparatus is provided to extend the lifetime of etchant by removing the metal ions remaining in the etchant by an absorption part. A wet etching part(210) etches a metal layer formed on a substrate by using etchant. An absorption part(220) absorbs the metal ions remaining the etchant, including an absorbing agent made of a mesoporous molecular sieve. The etchant passing through the absorption part is stored in a storage part(230). The etchant stored in the storage part is supplied to the wet etching part by a pump part(250). Etch residue in the etchant is filtered by the absorption part. The etchant stored in the storage part is exhausted by an exhaust part(260).
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