| 摘要 |
Methods and systems provide for a semiconductor die that is compatible with a wide variety of industry standard sockets, where each type of socket is identified by a different pin map. In one embodiment, the die has a plurality of signal lines, one or more surface contacts and one or more signal selectors coupled to the signal lines and the surface contacts. Each signal selector electrically connects one of the signal lines to one of the surface contacts based on a programming signal. In a particularl embodiment, each signal selector includes a multiplexer and a fuse element, where the multiplexer routes one of its input ports to its output port based on a programming value of the fuse element. The programming value can be set by the programming signal.
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