发明名称 Formation of a disposable spacer to post dope a gate conductor
摘要 A method of forming a doped gate structure on a semiconductor device and a semiconductor structure formed in that method are provided. The method comprises the steps of providing a semiconductor device including a gate dielectric layer, and forming a gate stack on said dielectric layer. This latter step, in turn, includes the steps of forming a first gate layer on the dielectric layer, and forming a second disposable layer on top of the first gate layer. A fat spacer is formed round the first gate layer and the second disposable layer. The second disposable layer is removed, and ions are implanted in the first gate layer to supply additional dopant into the gate above the gate dielectric layer, while the fat disposable spacer keeps the implanted ions away from the critical source and drain diffusion regions.
申请公布号 US7229885(B2) 申请公布日期 2007.06.12
申请号 US20040752386 申请日期 2004.01.06
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 HORAK DAVID V.;FURUKAWA TOSHIHARU;SEKIGUCHI AKIHISA
分类号 H01L21/336;H01L21/28;H01L29/76;H01L29/78 主分类号 H01L21/336
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