| 摘要 |
An optoelectronic component according to the invention contains a semiconductor chip (1) and a supporting body (10), which are provided with a transparent, electrically insulating encapsulation layer (3), this encapsulation layer (3) having two cutouts (11, 12) for exposing a contact surface (6) and a connecting area (8) of the supporting body, and contains an electrically conductive layer (14) leading from the contact surface (6) while passing over a partial area of the encapsulation layer (3) and extending to the electrical connecting area (8) of the supporting body (10) in order to electrically connect the contact surface (6) and the electrical connecting area (8). The radiation emitted from the semiconductor chip (1) in a main emitting direction (13) is decoupled via the encapsulation layer (3) that advantageously contains luminescence conversion substances for converting wavelengths of the emitted radiation. |
