发明名称 |
Method for coating package with a filter profile |
摘要 |
Method for packaging a photo detector integrated circuit (IC) and a pigment filter and resulting package are described. An encapsulated package (e.g., an epoxy-encapsulated package) that includes a first surface is provided. A filter layer is then coated directly onto the first surface. The filter layer provides optical filtering properties (e.g., a predetermined filtering profile) in addition to the filtering provided by the pigment filter.
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申请公布号 |
US7229671(B2) |
申请公布日期 |
2007.06.12 |
申请号 |
US20040902200 |
申请日期 |
2004.07.28 |
申请人 |
AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. |
发明人 |
KEH KEAN LOO;OON CHIN HIN;TAN BOON KEAT |
分类号 |
B32B27/38;B05D3/10;H01L25/00 |
主分类号 |
B32B27/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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