| 摘要 |
A component mounting apparatus includes a component feeder ( 20 ) that feeds a component ( 2 ) with its bump electrodes facing down, a mounting head ( 5 ) that mounts the component onto a substrate ( 3 ), a supporting base ( 8 ) that secures the substrate, and a positioning device ( 6, 7 ) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator ( 24 ), an ultrasonic vibration propagation member ( 34, 38, 54 ) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face ( 33, 41, 57 ) holding the component as vibration parallel thereto, a pressure loader ( 22, 23, 39, 55, 59 ) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater ( 32, 47, 49, 50, 51, 52, 53 ) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes ( 2 a) on its face.
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