| 发明名称 |
Method for producing a protection for chip edges and system for the protection of chip edges |
| 摘要 |
The invention relates to a method for producing a protection for the chip edges of electronic components that are not provided with a housing, according to which semiconductor chips provided with a laterally open bonding channel are mounted on a substrate with a tape interposed between. The invention further relates to a system for protecting chip edges. |
| 申请公布号 |
US7229857(B2) |
申请公布日期 |
2007.06.12 |
| 申请号 |
US20040890827 |
申请日期 |
2004.07.14 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
ZACHERL JUERGEN;REISS MARTIN;BLASZCZAK STEPHAN |
| 分类号 |
H01L21/00;H01L21/44;H01L21/48;H01L21/50;H01L21/56;H01L21/58;H01L23/13;H01L23/28;H01L23/31;H05K3/30 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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