发明名称 |
FLUID HEATING APPARATUS FOR MANUFACTURING SEMICONDUCTOR |
摘要 |
A fluid heating apparatus for fabricating a semiconductor is provided to remarkably shorten an interval of stand-by time by increasing a temperature at a high speed in an initial driving process. A ceramic heating body(110) of a tube shape generates heat of high temperature when current conducts wherein a mounting groove(114) of spiral type is formed on the outer circumferential surface of the ceramic heating body. A fluid heating pipe(120) of spiral shape is installed in the mounting groove of the ceramic heating body wherein both ends of the fluid heating pipe is connected to a fluid supply pipe for supplying predetermined fluid to process equipment for fabricating a semiconductor. The fluid flowing in the fluid heating pipe is heated by the heat generated from the ceramic heating body. The ceramic heating body and the fluid heating pipe are surrounded by a heat insulation member(130). A housing(140) is installed outside the heat insulation member to seal the heat insulation member.
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申请公布号 |
KR20070059570(A) |
申请公布日期 |
2007.06.12 |
申请号 |
KR20050118561 |
申请日期 |
2005.12.07 |
申请人 |
C&G HI TECH CO., LTD. |
发明人 |
KIM, HYUNG IL;HONG, SA MUN |
分类号 |
H01L21/324;H01L21/02 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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