| 摘要 |
An electroplating equipment that can form an uniform plating layer on a wafer is provided. In an electroplating equipment having a process chamber(1), the electroplating equipment comprises: an upper electrode assembly(20) which is installed in an upper region of the process chamber, and can mount a wafer(30) on a lower surface thereof; a lower electrode assembly(10) installed in a lower region of the process chamber; a membrane filter(50) installed between the lower electrode assembly and the upper electrode assembly; and isolating membranes(45) for dividing a space between the upper electrode assembly and the membrane filter into at least two space parts(A,B), wherein each space part has a region that comes in contact with the membrane filter.
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