| 摘要 |
A semiconductor processing apparatus including a heat shielding member is provided to avoid thermal deformation of magnetic fluid seal adjacent to a driving axis by disposing a heat shielding member between a gas injection part and a susceptor. A process space is formed in a chamber(110). A substrate(130) is placed on a susceptor(120) installed in the lower part of the chamber. A gas injection unit(210) is installed in the upper part of the chamber to inject process, confronting the susceptor and capable of rotating. An opening for flowing the process gas is penetrated in a heat shielding member(200) installed between the gas injection unit and the susceptor. Heat generated between the susceptor and the heat shielding member is prevented from being transferred to the gas injection unit by the heat shielding member. A cooling flow path for cooling the heat shielding member is formed in the heat shielding member. The opening of the heat shielding member can be a plurality of through holes or a plurality of slits.
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