| 摘要 |
A light emitting unit is provided to enhance a heat dissipation efficiency by installing a heat dissipation layer on a surface of a dielectric substrate to transfer heat generated from a light emitting diode chip directly to the heat dissipation layer. A light emitting unit includes a conductive heat dissipation layer(11), a dielectric substrate(13), a plurality of electrodes, one or more light emitting diode chips(20), and a lens(19). The dielectric substrate is formed on the heat dissipation layer and has a mounting groove(15). The electrodes are formed on the dielectric substrate and electrically isolated from each other. The light emitting diode chips are mounted through the mounting groove onto the heat dissipation layer, and electrically coupled with the heat dissipation layer and the electrodes so that each of the light emitting diodes illuminates a light. The lens is installed onto the mounting groove, and used to change a travel path of the light illuminated from each of the light emitting diode chips.
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