发明名称 |
METHOD FOR MANUFACTURING SUBSTRATE USING ENTRY BOARD FOR DRILL PROCESSING AND SUBSTRATE MANUFACTURED THEREBY |
摘要 |
A substrate using an entry board for drill processing and a manufacturing method thereof are provided to reduce burrs and cutting scraps even in a micro high speed drilling process. A method for manufacturing a substrate using an entry board for drill processing includes the steps of: processing a hole on at least one substrate through the entry board for the drill processing by rolling a first layer(113) and a second layer(115); stacking the entry board at an upper part of the substrate of at least one layer, and stacking a back up board at a lower part of the substrate of at least one layer; and processing the hole on the entry board, the backup board, and at least one substrate by a drill bit. The first layer(113) contains aluminum. The second layer(115) contains copper which is stacked on a plane of the first layer(113).
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申请公布号 |
KR100728765(B1) |
申请公布日期 |
2007.06.08 |
申请号 |
KR20070011192 |
申请日期 |
2007.02.02 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK, SE WON;NOH, JUNG HYUN;YEON, JE SIK;MAENG, DUCK YOUNG |
分类号 |
H05K3/46;B26F1/16 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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