ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATING METHOD

摘要

An electroless plating apparatus and an electroless plating method which can maintain a plating solution at high quality are provided. An electroless plating apparatus for supplying a plating solution onto a surface of a substrate to conduct electroless plating comprises: a supporting part for supporting the substrate; a plating solution retention part for retaining the plating solution that is supplied onto the surface of the substrate; a plating solution feeding pipe(96) for guiding the plating solution from the plating solution retention part to the surface of the substrate supported by the supporting part; a plating solution temperature control mechanism(97) for controlling a temperature of the plating solution circulating in the plating solution feeding pipe; and a suction mechanism(95) for sucking the plating solution in the plating solution feeding pipe toward the plating solution retention part when feeding of the plating solution onto the surface of the substrate by the plating solution feeding pipe is stopped.