发明名称 MANUFACTURING METHOD AND DEVICE FOR EPITAXIAL WAFER
摘要 PROBLEM TO BE SOLVED: To promote a heat exchange between a material melt reservoir and a material melt center. SOLUTION: A method of manufacturing an epitaxial wafer comprises processes of introducing epitaxially growing materials into material melt reservoirs 8(9, 10), fusing the materials by heating the material melt reservoirs 8(9, 10), and then bringing the growth surface of a substrate 7 into contact with melts kept in the material melt reservoirs 8(9, 10) to enable the substrate 7 to grow epitaxially. In the above epitaxial wafer manufacturing method, the surface regions of the substrate 7 brought into contact with the melt kept in the material melt reservoirs 8(9, 10) are expanded in area toward the centers of the material melt reservoirs 8(9, 10), to promote a heat exchange between the centers of melts and the material melt reservoirs 8(9, 10). COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007142119(A) 申请公布日期 2007.06.07
申请号 JP20050333335 申请日期 2005.11.17
申请人 HITACHI CABLE LTD 发明人 SHIMADA NORIO;SHIBATA YUKIYA;SUGAWARA TEPPEI;YAMAMOTO SHUNSUKE
分类号 H01L21/208;C30B19/06 主分类号 H01L21/208
代理机构 代理人
主权项
地址