| 摘要 |
PROBLEM TO BE SOLVED: To provide an arc ion plating apparatus where over temperature rise or abnormal discharge is hardly caused in the substrate upon bombardment, and process controllability is enhanced. SOLUTION: An arc ion plating apparatus comprises a vacuum chamber 1, a rotary table 2 for moving a substrate within the vacuum chamber vertically relative to its height direction, an arc evaporation source 9A for bombardment for cleaning the surface of the substrate with metal ions, and a plurality of evaporation sources 7A for deposition for depositing metal ions on the surface of the substrate. The arc evaporation source 9A for bombardment is formed so that the height of the evaporation face or the evaporation surface area thereof is larger than the cases of the evaporation sources 7A for deposition. COPYRIGHT: (C)2007,JPO&INPIT
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