RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, PREPREG, SUBSTRATE, METAL FOIL-CLAD LAMINATE, METAL FOIL WITH RESIN AND PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for printed circuit boards capable of forming a printed circuit board having sufficiently excellent flame retardance and flexibility and having sufficient reliability for insulation. SOLUTION: The resin composition for printed circuit boards comprises (a) an acrylic rubber, (b) an antioxidant, (c) a phosphorus compound and (d) a thermosetting resin. COPYRIGHT: (C)2007,JPO&INPIT