| 摘要 |
An image sensor chip package method includes the following steps: firstly, a plurality of <img id="custom-character-00001" he="2.79mm" wi="1.44mm" file="US20070126915A1-20070607-P00900.TIF" alt="custom character" img-content="character" img-format="tif"/> shaped conductors are provided. Secondly, plastics are injected to partially enclose the conductors, thereby forming a base. Some of the conductors are exposed outside of the base. Thirdly, a ring-like middle portion is further formed on the base by means of injection. The base and the middle portion cooperatively form a space. Fourthly, an image sensor having a plurality of pads is disposed in the space. Fifthly, a number of bonding wires are provided to connect the pads and the conductors. Finally, a cover is secured to the top of the middle portion via an adhesive glue, thereby hermetically sealing the space and allowing light beams to pass therethrough.
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