发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE AND DISPLAY USING SAME
摘要 <p>Disclosed is a positive photosensitive resin composition containing (A) an alkali-soluble resin, (B) a diazoquinone compound, (d1) an activated silicon compound and (d2) an aluminum complex. Also disclosed is a positive photosensitive resin composition containing (A) an alkali-soluble resin, (B) a diazoquinone compound, (C) a compound having two or more oxetanyl groups in a molecule and (D) a catalyst for accelerating the ring-opening reaction of the oxetanyl groups of the compound (C).</p>
申请公布号 WO2007063721(A1) 申请公布日期 2007.06.07
申请号 WO2006JP322951 申请日期 2006.11.17
申请人 SUMITOMO BAKELITE CO., LTD.;BANBA, TOSHIO;MIZUSHIMA, AYAKO 发明人 BANBA, TOSHIO;MIZUSHIMA, AYAKO
分类号 G03F7/075;G03F7/004;G03F7/023;G03F7/40;H01L21/027 主分类号 G03F7/075
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