| 摘要 |
<P>PROBLEM TO BE SOLVED: To more miniaturize a system in package where multiple semiconductor chips are stacked on a wiring board via a die attach film. <P>SOLUTION: In this system in package (SiP), memory chips 19A, 19B and a microcomputer chip 19C are stacked on a wiring board 3 via a die attach film 11. In a chip mount area of the wiring board 3, a metal plate 9 is formed and a lowest layer memory chip 19A is mounted on the metal plate 9 in a way that the chip mount area of the wiring board 3 is flat, and the quality and thickness of the die attach film 11 placed between the metal plate 9 and the lowest layer memory chip 19A are equal to those of the die attach film 11 placed between the chips (between the memory chips 19A and 19B and between the memory chip 19B and the microcomputer chip 19C). <P>COPYRIGHT: (C)2007,JPO&INPIT |
