发明名称 SEMICONDUCTOR DEVICE MANUFACTURING EQUIPMENT AND METHOD FOR MANAGING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide semiconductor device manufacturing equipment capable of suppressing an initial investment amount, as compared with conventional methods. <P>SOLUTION: The semiconductor device manufacturing equipment is provided with a first floor 1 of a clean room, in which a semiconductor device manufacturing apparatus is arranged; an air-conditioning means 63 for exhausting air in the first floor 1 from the floor of the first floor 1, cleaning the exhausted air, and supplying the cleaned air from the ceiling of the first floor 1 to the first floor 1; a second floor 3 which is a floor under the first floor 1; a reticle store 4 arranged in the second floor 3; and a suction port 41, arranged in the reticle store 4, and sucking in the air exhausted from the floor of the first floor 1 into the reticle store 4. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007142235(A) 申请公布日期 2007.06.07
申请号 JP20050335300 申请日期 2005.11.21
申请人 SEIKO EPSON CORP 发明人 YAMAGISHI TAKASHI
分类号 H01L21/02;G03F1/50;G03F1/66;H01L21/677 主分类号 H01L21/02
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