发明名称 SOLDER MATERIAL INSPECTION DEVICE, SOLDER MATERIAL INSPECTION METHOD, CONTROL PROGRAM FOR SOLDER MATERIAL INSPECTION DEVICE, AND RECORDING MEDIUM FOR RECORDING CONTROL PROGRAM FOR SOLDER MATERIAL INSPECTION DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a highly precise solder material inspection device favorable on working sanitation, and capable of restraining labors and time of work required for inspecting a degree of deterioration of a solder material. <P>SOLUTION: A light projection part 15 receives a print finish detection signal when a squeegee 13 detects the finish of print by a detecting part 14, and emits light toward a cream solder 12 of an inspection object filled in an inspection hole 111a, out of pattern holes 11a formed in a printing mask 11. An intensity detecting part 16 detects an inspection objective intensity of a specified wave number of infrared ray reflected from the cream solder 12 of the inspection object by the irradiation of the light, a processing part 17 transmits to an output part 18 a deterioration parameter indicating a relative deterioration degree of the cream solder 12 of the inspection object to a cream solder 12 of a comparison object, based on a comparison objective intensity of the specified wave number of infrared ray reflected and detected when irradiating the cream solder 12 of the comparison object in the cream solder 12 of the inspection object, with the light, and based on the inspection objective intensity, and the output part 18 displays a measured result. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007139727(A) 申请公布日期 2007.06.07
申请号 JP20050337790 申请日期 2005.11.22
申请人 OMRON CORP 发明人 HORINO MASANOBU;OHASHI KATSUMI;ONISHI YASUHIRO
分类号 G01N21/956;G01N21/35;G01N21/3563;H05K3/34 主分类号 G01N21/956
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