| 摘要 |
PROBLEM TO BE SOLVED: To realize a semiconductor device of a packaging structure for generating a stress of the desired distribution and amplitude in a channel region of MOSFET within a mounted chip and thereby increasing mobility even after the packaging manufacturing step. SOLUTION: A packaging structure is obtained for generating the stress of the desired distribution and amplitude in the channel region of MOSFET within the mounted chip, even after the packaging manufacturing step and thereby increasing mobility to provide increment of current driving force, by providing a structure for applying a stress to the channel region to the semiconductor chip itself and then mounting a low thermal expansion coefficient film 2 in the side of the circuit plane of a Si chip 1 in the packaging manufacturing step. COPYRIGHT: (C)2007,JPO&INPIT
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